DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic.
This report includes market status and forecast of global and major regions, with introduction of vendors, regions, product types and end industries; and this report counts product types and end industries in global and major regions.
The report includes as follows:
The report provides current data, historical overview and future forecast.
The report includes an in-depth analysis of the Global market for DBC Ceramic Substrate , covering Global total and major region markets.
The data of 2017-2025 are included. All-inclusive market are given through data on sales, consumption, and prices (Global total and by major regions).
The report provides introduction of leading Global manufacturers.
DBC Ceramic Substrate market prospects to 2025 are included (in sales, consumption and price).
Market Segment as follows:
By Region / Countries
North America (U.S., Canada, Mexico)
Europe (Germany, U.K., France, Italy, Russia, Spain etc)
Asia-Pacific (China, India, Japan, Southeast Asia etc)
South America (Brazil, Argentina etc)
Middle East & Africa (Saudi Arabia, South Africa etc)
AlN DBC Ceramic Substrate
Al2O3 DBC Ceramic Substrate
By End-User / Application
Home Appliances and CPV
Aerospace and Others
Ferrotec(Shanghai Shenhe Thermo-Magnetics Electronics) (China)
Heraeus Electronics (Germany)
Tong Hsing (Taiwan)
Stellar Industries Corp (US)
Nanjing Zhongjiang New Material Science & Technology (China)
Zibo Linzi Yinhe High-Tech Development (China)
NGK Electronics Devices (Japan)
IXYS (Germany Division)
Mitsubishi Materials (Japan)